制造工艺_生产能力_东莞市玮孚电路科技有限公司

制造工艺

用精湛的技术制作中国世界品牌

Every year, VIAFINE have to put in a lot of manpower and money to continuously upgrade Manufacturing Processes to meet customer newer and higher technical requirements and lower costs.

The engineering process in manufacturing and treating material for PCBs is the primary factor determining the quality of final Printed Circuit Boards. VIAFINE provides the best available engineering processes in each of our production plants. Each engineer we employ is an expert and an innovator in the field of Printed Circuit Board Production. Each worker on our lines is carefully trained in precision management of the machines and materials he or she works with.

Our processes are transparent to customers. You can see an outline of each step on Manufacturing PCBs below.

Standard Default Criteria for PCBs material and Processing:

1.	IPC Standard	Inspection and test criteria will be based upon IPC-A-600 and IPC-6012, Class 2 unless otherwise specified on customer drawings or specifications.
2.	Markings	Customers can specify the Marking. default marking is VIAFINE branch factory's marking.
3.	Laminate	Single side boards: FR-1, FR-2 or FR-4 glass epoxy laminate per IPC-41011 with a minimum Tg 110 C. Starting clad copper weight to be 1?OZ / FT 2 minimum. Double sided plated-through boards: King Baord, FR-4 glass epoxy laminate per IPC-4101 with a minimum Tg of 130 C. Starting clad copper weight to be 0.5?OZ / FT 2 minimum. Multilayer boards: King Board, FR-4 copper-clad glass-epoxy? ( tine core ) and laminateand material ( prepreg ) per IPC-4101with a minimum Tg of 135 C Starting clad copper weight to be 1 OZ / FT 2 minimum on all internal layers and 0.5 OZ / FT 2 minimum on external layers.
4.	Copper Plating	Holes with copper pads on both sides are to be copper plated through. Copper plating thickness will be in accorde with IPC-6012, Class 2 (0.0008" avg. minimum thickness ). When copper pads on artwork are smaller or the same size as the corresponding finished holes, SCT will regard the hole as not requiring plating.
5.	HASL	Copper features exposed by PCB Solder Mask, except nickel / gold plated edge contacts, will be coated by Hot Air Solder Leveling (HASL). SCT monitors the HASL processes to ensure that boards meet the solderability requirements of IPC6012 class 2.
6.	Nickel/gold Plated surfaces	Nickel/gold plated surfaces: For contact surfaces: a minimum thickness of 0.8 gold over 150 nickel; and for solderable surfaces.
7.	Holes Dimensional	Finished plated through hole size tolerances will be in accordance with IPC-D-300, Class 2: Finished holes up to 0.032" ... 0.003" Finished holes from 0.033" to 0.063" ... 0.004" Finished holes from 0.064" and larger ... 0.006".
8.	Board Size	Max. Board Size 864 x 610 mm (34" x 24")
9.	Soldermask	Green Liquid Photo Imageable Solder Mask (LPI) will be applied over bare copper traces. The mask material will comply with IPC-SM-840 Type B, Class II. Unless specifically prohibited by the customer.
10.	Comp. Mark	When required, nomenclature will be printed on the component side of the board with white non-conductive epoxy ink or acrylate equivalent.
11.	Bow and twist	Bow and twist will not exceed 0.75% for boards bearing surface SMT mount components, and 1.5% for all other boards.
12.	Others	Unless otherwise specified, thickness tolerances will be 10% of the finished board thickness, not including surface copper.

Multilayer PCB Manufacturing Processes

Double Sided PCB Manufacturing Processes

Single-Sided PCB Manufacturing Processes